The present invention discloses an image sensor module and forming method of wafer level package. According to one embodiment, the adjustable nozzle includes a base member having an aperture therethrough defining a nozzle inlet. A deep ion implant layer is implanted to reside below an oxide insulator. The receiving chambers are allocated to the coil ends which form an electric clamping connection by pairs with the terminals of the connection conductors at the receiving chambers. Additionally, the target detection system may also include processing circuitry to compare the first decay characteristic to the second decay characteristic to determine a presence and a distance of a target. %, referred to the binder solids of the electro-dipcoating bath, of one or more phosphoric acid epoxy esters andor phosphonic acid epoxy esters that have been produced in the presence of alcohols.