A crop-processing device with a picking-up and cutting device for picking up and cutting an agricultural product. The procedure includes measuring a fixed change in pressure above ambient pressure and a fixed change in pressure below ambient pressure. When a prescription is received at an originating pharmacy, it is fulfilled from the base inventory or cooperative inventory at the originating pharmacy. A thinning process is performed to thin a second surface of the wafer so as to expose the internal conductive layer in the through holes. Since the material of stop layer is different from the material of barrier layer, the high selectivity is easily achieved.