The present disclosure relates to a non-sintering metal-insulator-metal capacitor and a method of manufacturing the same. The UEFI BIOS can include a PEI manufacturing mode driver, a PEI interface, PEI drivers, a DXE manufacturing mode driver, a DXE interface, DXE drivers, a SMM manufacturing mode driver, a SMM interface, and SMM drivers. The contact surface comprises a metal coating configured for increasing sealing. Transmit power may be adjusted for a signal transmitted via at least one uplink communication channel based on the calculated sign metric. The hardware TPM includes a finite number of storage locations, called context slots, for storing contexts. Cams may be attached to the front and rear crank journals which act upon the ends of a leaf spring to store and release energy.