Integrated micro-valve is formed to control fluid flow and pressure. More particularly, the present invention relates to a dicing film wherein a shrinkage release film is inserted between an adhesive film for dicing a wafer and a die adhesive film so that the die adhesive film and a die can be easily separated from the adhesive film for dicing a wafer when picking up a semiconductor die, and a method of manufacturing a semiconductor package using the same. The plurality of penetrating members are each at least partially contained in cavities of the cartridge wherein the penetrating members are slidably movable to extend outward from openings on said cartridge to penetrate tissue.