A method is proposed for fabricating a substrate-based semiconductor package without mold flash. Said graphene may have further structures, such as nanopores, nanogaps, and nanoribbons. At least one seal frame matching OLED in size is formed through painting glass frit seal on the packaging board at a position corresponding to the OLED. The label module has at least a label and is disposed on the dental cast. An air flap of this type is used, in particular, as a fresh-aircirculating-air flap.