A communication device setting apparatus is arranged to register setup information in a communication device connected to the communication device setting apparatus via a communication network. In one embodiment, an integrated circuit device comprises a memory array integrated on a substrate with a decoder and a cache also integrated on the same substrate. Removal of the seal head from the outer link bore causes as-installed clearance passageways between the seal head and seat portions and the spacer to forcefully close and prevent abrasive particles from getting inside the seal and reaching the interior interface junction of the dynamic sealing surfaces during seal maintenance. For this purpose, the arm is mounted on a slide that is pulled into a release position by tension springs. The aluminum can be uniformly deposited centrally where maximum temperature concentration is desired, and deposited in patterns that allow for temperature attenuation in parts of the package where this is desirable.