A semiconductor chip is shown containing an integral heat spreading layer that more effectively transmits heat from the die to ambient as a result of spreading the heat out on the die over a larger cross sectional area. The method tests an electronic circuit by applying to the electronic circuit a first subset range of the plurality of test patterns sequentially in the order, from a first test pattern to a first log interval after the first test pattern, thereby generating a first associated output. An encapsulated plasma sensitive device is also described. Such actions may include, but are not limited to, printing, sending electronic mail, and performing other actions in the computer system. The automation system controls the automation system to return to the content signal in response to monitoring the content signal when the break ends on the content signal before an end of the insertion material.