A complementary metal-oxide-semiconductor image sensor, including a wiring layer, a photodiode stacked with the wiring layer, a micro-lens stacked on the photodiode, an anti-reflection layer stacked on the photodiode. Also disclosed is a product made by the aforesaid process. The surface layer has two or more phases including a phase strongly adhering to the under layer and another layer contacting the above phase. An interface board can be used to correct the pin arrangements, which are reversed because they protrude from the back side of the board, and to compensate for the environmental differences caused by use of sockets and additional equipment on the interface board. The method includes applying a material around a drain opening of the fuel tank; the material directs an electric charge away from the drain valve. The data packet from each of the plurality of communication devices is transferred on the network of the loop structure in one direction.