A recess is formed into a first side of a wafer such that a thinned center portion of the wafer is formed, and such that the central portion is surrounded by a thicker peripheral edge support portion. A first green tire is formed in a first step molding machine and then removed from it. The first and second first side support surfaces are each bounded along first and second edges thereof by rake surfaces forming non-zero angles with the first and second side support surfaces and along third edges thereof by the groove. Transferring the one or several output signals from the transformation table to an evaluation unit wherein position determination between the two objects is performed.