A cementing head is provided for introduction and separation of fluids in a well. The semiconductor package is assembled such that a lower substrate to which the semiconductor chip is attached is adhered to an EMI shielding & electric IO body having various types of EMI shielding & electric IO metal patterns by soldering. A sensor couples to the flow passage. The disclosure also relates to a method for the high-pressure treatment of products, wherein pressure decrease takes place in a first phase and in a second phase, and the mean pressure decrease rate in the first phase is higher than in the second phase.