A transport temperature control apparatus includes a refrigeration circuit and a heat exchanger having an air inlet and an air outlet in fluid communication with a conditioned space. The NMOS switching transistor and the PMOS switching transistor of the selection transfer gate are arranged opposite to each other in a column direction to sandwich the memory cell array. A signal bridge, with a bridge element, transceives optical signals between the optical plug and a backcap processing module. The long-range continuity of the film can be disrupted simply by etching channels in the surface of the wafer.