Disclosed herein is a grounding connector. The cleaving apparatus cleaves the band-like glass film, which is being conveyed in a longitudinal direction thereof, along a conveyance direction thereof using a thermal stress generated through localized heating and cooling of a heated region. The motion is extracted from projection data by tracking the change over time in projections from the same projection angle andor conjugate projection angle pairs. The laser device may further comprise a third waveguide positioned between the first and second waveguide for providing isolation between the gain region and modulator. The method also includes mirroring the current using a current mirror circuit and converting the mirrored current to the PTAT voltage using a second pseudo resistor. A circuit element is provided to interrupt this inducible current.