To pick and place standard dies on a new base for obtaining an appropriate and wider distance between dies than the original distance of dies on a wafer. In this way, it is always possible to identify the importing device for a given content material. An output shaft coupled to a lower end of the lamp unit can be rotated around its axis and slide in a direction perpendicular to the axis. This allows the total ion milling etch mask thickness to be well controlled before the ion milling process used to define the sensor side walls.