The present invention is directed to a method forming conductive templates that includes providing a substrate; forming a mesa on the substrate; and forming a plurality of recessions and projections on the mesa with a nadir of the recessions comprising electrically conductive material and the projections comprising electrically insulative material. The stent constitutes a metal scaffold. Such means may include the capability to utilize bonding pads on all four sides of an integrated circuit. By the particular choice of 45 individual bends, a pair of such achromats can be used as the basis of a 180 recirculation arc. The invention is characterized by the fact that at least some of said reinforcing elements are spaced from each other, so that they are totally encompassed by the elastomer material. The server may include a network interface configured to be communicatively coupled to a network.