A method for making stiffened cellulosic fiber in sheet form, and the resultant stiffened cellulosic fiber. One embodiment of a method for fabricating a semiconductor device comprises forming a dielectric layer on an active side of a semiconductor substrate. \u201d Channel bonding allows smaller bandwidth upstream channels to be bonded together to create a larger bandwidth pipe. The encapsulant is over a top of the flag and a bottom of the flag is uncovered by the encapsulant. , and about 20 phr to about 60 phr of carbon black, wherein the carbon black has a dibutylphthalate absorption value of at least 140 cm3100 grams and wherein the carbon black has a cetyl trimethyl ammonium bromide adsorption area which is within the range of about 60 to about 90.