A semiconductor package resin composition of the present invention includes an epoxy resin, a curing agent, inorganic particles, nano-particles surface treated with a silane that contains a photopolymerizable functional group, and a photopolymerization initiator. The object of the invention is to provide a process for preparing bromoisophthalic acid compounds, particularly 5-bromoisophthalic acid compounds and 4,5-dibromoisophthalic acid compounds in a highly selective manner by using bromine that is industrially inexpensive. A radio signal emitted in the given timeslot directed at the first user station is superimposed with a second radio signal, the transmission power of which is sufficient to reach in the direction of the second user station, in order to permit a precise reception of the control information. An exemplary use is the packaging of electronic components and the like.