The present invention relates to a dicing die bonding film, which is able to maintain good workability and reliability in any semiconductor packaging process, such as adhesive property, gap filling property and pick-up property, while controlling burr incidence in a dicing process and thus contamination of die, and a dicing method. Troubleshooting can occur in multiple modes of operation including: full diagnostic, interactive, and undeliverable mail status information. The discrete functional module includes a second body containing an integrated circuit, the second body characterized by a pair of main faces and a side surface between the pair of main faces. In accordance with another embodiment, a computer-readable medium is also provided that contains code for generating the computational logic mentioned above. The object is attained by providing an anode active material for a sodium ion battery comprising an active substance having an MNb3O8 phase belonging to an orthorhombic crystal, and a carbon material contacting with the active substance, wherein the active substance and the carbon material are composited. A computing device uses the spatial placement of the measured body part to determine the desired vibratory stimulus to be provided by the vibrotactile unit.