A method of forming a device package having an edge interconnect pad includes forming an array of MEMS devices overlaying at least one conductive via that electrically connects to an underlying layer. \u201d, \u201cidentification No. Each initiator is for use in generating a low frequency initiation signal for receipt by a tire receiver to cause the transmitter to transmit a tire pressure signal. The open end of the housing is closed by the covering member to thereby form the economizer. An opposing concave surface is on the wall of the housing facing the raised contact surface. An annealing process then recrystallizes the amorphized regions by solid-phase epitaxy regrowth to form the source and drain regions.