The present invention relates to a semiconductor package containing a package substrate, integrated heat spreader, and semiconductor die. In one embodiment, a microcontroller-implemented RTC counts elapsed seconds from a pre-determined system timestamp using a low-speed, low-accuracy crystal. With such a configuration, even if the arc tube bursts to cause a crack in the reflector, the cover glass prevents scattering of the broken pieces of the reflector. The moment resisting section connects to the origin end of the longitudinal fold of the card and extends along the card edges from the origin to reinforce the card edges.