Lead-over-chip leadframes for coupling the chip bond pads to the interconnect pins of a memory package contain at least one composite lead for coupling an interconnect pin to chip bond pads in multiple quadrants or on opposite sides of the memory chip. The gas source continuously supplies compressed gas to the component in response to an input. A representation of the received media may be presented in a media guide andor a channel guide at the first location and the received media may be consumed at the first location. The at least one condition is defined such that the communications device does not erroneously attempt to establish an emergency call when there is no emergency.