A guided keeper assembly and related method includes a cylindrical base that mounts to a die member using a multi-piece, interlocking flange. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. Processor execution units, responsive to the instruction, perform a number of SM3 message expansions, from the first and second source data operand sets, determined by the specified expansion extent and store the result into a SIMD destination register. The retaining member is spaced proximally from the handpiece head. The p-buried layer may be formed above an n-buried layer in the substrate for high-side driver transistor applications, wherein the p-buried layer extends between the drain-extended MOS transistor and the n-buried layer to inhibit off-state breakdown between the source and drain.