A high power RF IC capable of impeding parasitic current loss and method of manufacturing the same. The glass substrate contains 65 to 90 mass % of SiO2+Al2O3+B2O3, 7 to 20 mass % of R2O, 0. The system tests insulated conductors using a high-voltage breakdown tester, a connection integrity tester capable of identifying unintended connections, a means of connecting the tester to the conductors, and an inflatable bladder that causes a conductive material attached to the two testers to conform to the shape of the conductor. A barbed tab is disposed between the first and second slots.