A receiving unit, receiving method, and semiconductor device that reduce the size of circuits in a receiving unit. The device supports direct connection of eddy current probe systems to the module, due to a built-in driver and linearization functionality. The first locking section is accommodated in the first engagement concave section with gaps left in the thickness and cross-sectional directions. In a self-assessment system and method, a graphical user interface is provided along with a target image and factor icons.