A semiconductor device, which is obtained by sticking an adhesive sheet 1 comprising a base material 2, an adhesive agent layer 3 formed on the base material 2 and conductor bodies 4 buried in the adhesive agent layer 3 to a semiconductor wafer, and removing the base material from the adhesive agent layer of the adhesive sheet 1. The solid state drive extends in a first longitudinal direction. A wind power plant is also presented. In another embodiment, each query may be monitored but the query implementation information is only selectively logged. A process temperature of the implantation process is no more than about \u221250\xb0 C. Low bandwidth is achieved because most of the production is done at the client location without relying upon slow, bandwidth-limited downloading of conventional network video formats.