This invention discloses an integrated circuit chip which comprises a first, second and third bonding pad connected exclusively to a first, second and third probing pad, respectively, wherein the first bonding pad, the second probing pad and the third bonding pad are substantially aligned linearly with the second probing pad being placed between the first and third bonding pad. The electronic components may include a light source for providing a photonic signal through the substrate to the photonic components. The latter are deformed back into an essentially planar starting position upon leaving the rounding turret and thereafter.