A ball grid array package having a half-etched bonding pad and a cut plating line and a method of fabricating the same. The radiation sensing system may include a high LET detector and a low LET detector coupled to the high LET detector by a CPU, wherein the high LET detector and the low LET detector are assembled within a single unit. The controller generates the voltage control signal with a second level to stop the power converter from generating the light driving voltage when the operation state of the light emitting strings is in an abnormal state.