A PCB mountable module includes logic circuitry that translates between serial and wireless communication protocols. By this method, and also using a reducing gas, it is possible to obtain UO2 with an O:U ratio less than 2. An engagement structure is provided at the circumference of least a part of the outer surface projecting above the first end of the receiving part, the structure being engageable with a tool in a form-fit manner and wherein a maximum outer diameter of said first locking member in the region of said structure is larger than the inner diameter of the internal thread of the receiving part. 9 compared to the width of 1 can be formed.