A high-silica glass sheet has an average thickness of less than 150 microns and an average surface roughness over one or both of its two major surfaces of less than 1 nm. The tray has a base wall formed with ribs projecting from its upper face and from its lower face, respectively. The wiring structure also includes, in embodiments, a method of simultaneously forming a MEMS structure with a transistor circuit using substantially the same steps. In another aspect the present invention provides a first type of particles containing a Cu-Group IIIA alloy wherein a molar ratio of Cu to Group IIIA material within each of the particles is at least 1. A publication provider wishing to provide metric data via the subscription service send a message to the subscription server indicating which metric information it publishes. A center conductor line width w1 of each of the resonators 5a to 5d is equal to a center conductor line width wio of each of the inputoutput terminal section 4a and 4b, but a ground conductor spacing d1 of each of the resonators 5a to 5d is greater than a ground conductor spacing dio of each of inputoutput terminal section 4a and 4b.