A package-ready light-sensitive integrated circuit and process for preparing a light-sensitive semiconductor substrate for packaging that provide for a reduced exposure of a light-sensitive integrated circuit to light. The device includes at least one antenna assembly including antenna elements for the reception of transmitted secondary radar signals, a signal processing unit connected via a connection point to the antenna elements for the joint processing of received antenna signals, outputs associated with a couple matrix in the signal processing unit and individual receivers. The scribe line areas include at least a first metal line and a second metal line respectively connected to the first pad and the second pad of each of the plurality of dies. Thus, there is no requirement that this device must be subjected to external refrigeration or heat. A main filter element filters residual contaminants from the suction airstream between the chamber and the suction source. By bonding a wafer of compound semiconductor material as an active region to silicon and removing the substrate, the lasers, amplifiers, modulators, and other devices can be processed using standard photolithographic techniques on the silicon substrate.