A semiconductor chip packaging structure comprising a dielectric film having one or more through holes aligned with the one or more contact pads of at least one power semiconductor chip. The drain region is laterally separated from the conductive gate by a field oxide that encroaches beneath the conductive gate. In another form, a clip-on light apparatus is provided that includes a spacer frame having opposite end portions each mounting lights, preferably constructed as described above. The resulting laser cavity is therefore a folded cavity. Further, an annealing separating agent is applied on the surface of the decarburized nitrided steel sheet and finish annealing is performed, and thereby a glass coating film is formed. A lightweight cement composition of the invention is basically comprised of a coarse particulate hydraulic cement, an ultrafine particulate hydraulic cement mixture comprised of slag cement and a Portland or equivalent cement, fly ash, fumed silica, hollow glass spheres and water.