A method of forming a metal interconnect structure includes forming a copper line within an interlevel dielectric layer; directly doping a top surface of the copper line with a copper alloy material; and forming a dielectric layer over the ILD layer and the copper alloy material; wherein the copper alloy material serves an adhesion interface layer between the copper line and the dielectric layer. The data model includes data defining a plurality of hierarchically arranged subsets of space within the modeled environment and data defining a plurality of items populating the modeled environment. A reproduction end time of content under reproduction is calculated and a time earlier than the reproduction end time by the processing time is caused to be a request time when content data of a second tune is requested. Each jack also includes a media reading interface configured to interface with a PLM interface of a connector connected to the front attachment point. The front and back recesses are configured to secure an inflatable body that substantially surrounds the saddle with the footing surfaces at least partially exposed. The heat conductive member is thus reliably prevented from a downward movement regardless of the melting of the bonding material.