The present invention relates to lactoferrin compositions and methods of using the compositions to treat wounds. The interconnect structure includes a semiconductor substrate and a plurality of stacked structures formed thereon, each stacked structure including a conductive line and a conductive plug thereon. The spoken input is transmitted to a computer server system that is remote from the computing device. The tuftless gap extends through an arc of between about 20\xb0 and about 40\xb0.