A device is formed from an integrated circuit which comprises a substrate; drive circuitry arranged on the substrate; and a plurality of micro-electromechanical devices positioned on the substrate. A camera 7 is provided on a position opposed to a microplate accommodating portion of an uppermost stage in the stacker 3. Various techniques for performing the method and various products taking unique advantage of these techniques are disclosed for providing novel fastener products. The first and second conductive pattern layers are electrically connected to each other through a first via hole. The example method may also include providing data identifying the set of GUI components.