A semiconductor device package is comprised of a metal base for receiving a semiconductor device, a metal frame joined at its lower face to the metal base, a seal ring joined at its lower face to an upper face of the metal frame, and a metal lid joined to an upper face of the seal ring. The off-module connector system includes a top connector bracket which engages the attachment slots on the panel frames and a bottom connector bracket which engages an associated rack to securely, yet removably, mount the two partition panels in an off-modular relationship. The semiconductor wafer is coupled to a carrier substrate by a UV-curable adhesive film.