The manufacturing method of the panel installation portion 12a allows the portions of the upper block and the lower block for forming the panel installation portion to be exchanged as the nesting blocks upon press working so as to change the protruding amount of the panel installation portion from the outer peripheral surface. The system includes a first laser beam system which directs a first laser beam at a surface of at least one workpiece to create a molten puddle on the surface and a wire feeder which advances a consumable to the molten puddle so that the consumable contacts the molten puddle. The sheet of holographic material may be used to provide a decorative cover for an object or item, such as a floral grouping or a potted plant. In another embodiment, the thinned semiconductor chips of this semiconductor device according to the invention have low-microdefect edge side regions with semiconductor element structures and edge sides patterned by etching technology.