To accommodate high power densities associated with high performance integrated circuits, an integrated circuit package includes a heat-dissipating structure in which heat is dissipated from a surface of a die to an integrated heat spreader through a high capacity thermal interface formed of metal that has been injected in a semi-solid state. The mold member has a heat insulating layer closely attached to an inner surface thereof surrounding a motor rotor and to an outer surface thereof in an axial direction. The tip cover portion has a distal end with an opening therethrough sized to receive the end effector of the electrosurgical instrument and is composed of a first, electrically insulative material having a flexibility sufficient to allow the end effector to be manipulated while the end effector is received in the opening. The message thus formatted is then routed, through a multimedia server of a telephony operator, up to an intended recipient terminal where it will be interpretedconsulted. The reflectance measuring pattern is a diffraction grating.