An optical alignment system for optimizing a gap distance between an optical fiber end and an optical device uses an atomic force present when the gap distance approaches optimal alignment according to changes in an oscillating fiber amplitude at a fiber resonance frequency. The sealing seamsflaps are positioned especially on a main surface of the vacuum insulation panel. The wafer carrier allows handling of the wafer during back-grinding the inactive surface, forming under-bump metal pads on the TDVs and attaching the daughter dice.