A method, machine readable medium, and system are disclosed. The cup prosthesis has an attachment member applied around the circumference of the cup. The oxide semiconductor pattern includes a first semiconductor pattern including indium oxide and a second semiconductor pattern including indium-free oxide. The material in the foamed layer includes a rigid polymer component and a ductile polymer component in a mixing ratio of from 1:3 to 3:1, and in addition the foamed layer constitutes at least 50% of the total weight of the bottle. The method includes the steps of: forming a conductive silicon layer for a bottom electrode on a substrate; nitridating the conductive silicon layer; oxidizing the nitridated conductive silicon layer; forming a silicon nitride layer on a surface of the oxidized layer; forming a dielectric layer on the silicon nitride layer; and forming a top electrode on the dielectric layer.