A fabrication method of a semiconductor device includes forming an interlayer dielectric film over an entire surface of a semiconductor substrate that includes a lower line. A regulator is coupled to receive an indication of a ripple amplitude and a ripple phase of the residual AC ripple and to generate, responsive thereto, a correction voltage which is combined with the PFC voltage to generate a DC output voltage in which the AC ripple is substantially reduced relative to the PFC voltage. The document feeder includes: a document size obtainer that obtains size information indicating a width of the document sheet; and a center-of-contact shifting mechanism that shifts a center of contact of each pick-up roller along an axial direction of the pick-up roller according to the obtained size information. The geometry and thicknesses of the respective layers of the cell allows incident light of various angles to be absorbed by all of the semiconductor layers of the cell. The hull is made according to this method. The present invention also relates to an encoder reading device that projects a pattern formed on an encoder onto a light receiving means using light emitted from a light source means so as to read a position of the encoder.