This invention relates to granules comprising a homogenous mixture of metal flakes andor metal powder and metal oxide powder, and a binder. The polygons supported include, but are not limited to, points, lines, triangles and rectangles. The general formula is subject to the proviso that when n=2, each Xz may be the same or different and that both Xz moieties may not be hydrogen. The insulating resin layer is formed between the wiring board and the semiconductor chip to surround the internal connection terminals.