Devices for repairing and replacing a heart valve in various embodiments, the devices include at least first and second support rings connected together in a coiled configuration to abut opposite sides of a valve annulus. The at least one heating component is positioned on the board so that when a current is applied to the at least one heating component, a temperature sensor attached to a battery in contact with the circuit board is heated by the at least one heating component. The displacement amount is outputted as a voltage value that is then converted into the magnitude of the stressstrain according to the principle of a nano diffraction method, and the magnitude is displayed in synchronism with a sample position signal. The pins include portions protruding from the stack of dies that serve as input-output terminals of the package.