An optical sensor chip device and a corresponding production method. The first transmission line has a first end coupled to receive an input signal and has a second end. The corners of the lid are cut off diagonally at an angle of approximately 45 degrees or rounded so as to correspond to the cutouts of quarter circles at the corners of the base that result from via holes for wiring inside the base. A first end of the first covering element is connected to the first component, and a second end of the first covering element includes a first limit part.