A method of fabricating a semiconductor apparatus includes forming a base member and a conductive layer on a first surface of a semiconductor substrate. The created media asset illustrations are useful for media assets that lack associated media asset illustrations. An exposure score, an impact score, a likelihood score, and an element score may be determined for each risk element. With a flattened beam intensity distribution, the incident beam power can be increased without the beam intensity exceeding the damage threshold of the wafer at any particular location.