Systems and methods for three-axis sensor chip packages are provided. In the relief groove, an ink ribbon to be taken up around a take-up reel is exposed and, in a cassette mounting section, a ribbon guide section is formed to help the ink ribbon to be taken up around the take-up reel in the state where the ink ribbon exposed to the relief groove of the mounted ribbon cassette is bent toward the lower portion of the relief groove. A plurality of shelves are attached, either directly to the side arms, or to a back attached to the side arms. The rail segments define a first pressure face that engages against an outward pressure face of the dovetail lobes, and a second pressure face that engages against an inward pressure face of the respective disk hoop component.