An apparatus for transferring charge has a first charge pump path with a plurality of stages having first capacitors, and a second charge pump path, also with a plurality of stage having second capacitors, in parallel with the first charge pump path. In one embodiment, the semiconductor package includes an exposed portion of a conductive strap at a package horizontal first surface and exposed surfaces of multiple leads at a package horizontal second surface. The packet-encrypted data is then transmitted to the airborne platforms. The machined surface is smooth and does not require a second time machining. By controlling the buck-boost converter based on multiple voltage thresholds, it is possible to provide a smoother transition between the buck mode and the boost mode, thus reducing voltage errors in the DC output voltage and improving reliability of the DC voltage conversion circuit. The pressure transducer is located near the output port.