The present invention relates to the reduction of critical dimensions and the reduction of feature sizes in manufacturing integrated circuits. Corresponding computer program, apparatus, user interface, and system are also disclosed. The present invention includes a bonded automobile engine assembly including at least one plastic component, an adhesive that bonds the plastic component to at least one separate component, and an adhesion promoter between the adhesive and the plastic component. The capabilities of an additional computing device to be associated with the user may be determined.