Provided is a semiconductor package including multiple semiconductor chips, and separate groups of leads connected to the semiconductor chips. The system includes audio communications devices connected to Session Initiation Protocol endpoints with multiple line capabilities and a unique Uniform Resource Identifier associated with audio communications that has the form x@y. The lead frame has a fixing terminal fixed to the heat sink through an adhesive layer. A method of manufacture of a biofilm support and a waste water treatment system employing the biofilm support are also disclosed.