A solvent composition and system is disclosed having a composition including n-propyl bromide and a propionate containing liquid andor a butyrate containing liquid. A method of embodiments of the invention may include separating, via a cavity, a first conductor of an interconnect from a second conductor of the interconnect, and isolating, via the cavity serving as a buffer, a first electrical path provided through the first conductor from a second electrical path provided through the second conductor. In particular, during processing, a wafer is rinsed in a liquid bath and subsequently exposed to a chemically reactive additive. The air-tight seals around the electrically conductive bars are formed such that at least one metal material selected from metals and oxides of said metals is provided near the regions lying between the high-melting vitreous material and the electrically conductive bar. A filling needle is in fluid communication with a third one of the ports. Such polymers may comprise an anionic graft polymer comprising an anionic polymer backbone with pendant carboxylic acid groups and pendant chains comprising amphipathic or hydrophilic polymers covalently bonded to a portion of said pendant carboxylic acid groups.