The transmission of data is distributed evenly and predictably over a given number of communication channels using a hash function. The electricity-producing module includes a rack, first and second gears, and a spring buffer. The second semiconductor package includes a second semiconductor package base having a second cavity formed therein, a second mount component mounted in the second cavity, and a second magnet disposed on the second semiconductor package base so as to adsorb the first magnet. In the open position, the third partition member may be located to one side of the opening, overlapping one of the first and second partition members or may be located above or below the opening, away from the first and second partition members. A failure cause determining device identifies which manufacturing device or processing step has caused the failures in the wafer process based on the above distribution. The processing unit then correlates the accumulated signal with a reference signal to produce a correlation peak, from which the time delay of a synchronization code within the interval can be calculated.