In a printing apparatus, verification of the correctness of a particular replaceable module takes place before an operating element of the printing apparatus fully engages the replaceable module. The method includes etching a stud from a semiconductor material including a first spacer positioned on the sidewalls of the deep trench, wherein two of the sidewalls are formed of isolation trench oxide. A silicide layer is formed on the first and second regions excluding at least a portion in which the TSV electrode should be formed.